All articles

This article primarily discusses the application of photolithography mask imaging inspection technology in the semiconductor industry.

This article is about monochromatic micro X-ray fluorescence.

This article mainly introduces the advantages of hyperspectral imaging, which combines image technology and spectral technology.

This article provides a comprehensive guide on testing the conductivity of composite materials, covering both electrical and thermal conductivity. It includes various methods, tools, and best practices to ensure accurate measurements.

This article provides a brief example of the application of contact angle testing in the field of materials.

The concept of contact angle is fundamental in material science, serving as a measure of the wettability of a solid by a liquid. This angle, formed at the interface between a liquid droplet and a solid surface, provides critical insights into the interaction between the two phases. The contact angle is influenced by the intermolecular forces between the liquid, solid, and surrounding medium, making it a vital parameter in various scientific and industrial applications.

SEM is indispensable in semiconductor failure analysis, providing high-resolution imaging, elemental analysis, and cross-sectional insights crucial for identifying and mitigating device failure modes.

Semiconductor material testing methods include SEM, optical microscopy, XRD, Raman spectroscopy, and electrical tests like Hall effect and conductivity. These techniques evaluate surface structures, crystal composition, and electrical properties, optimizing materials for electronic devices.

Differential Scanning Calorimetry (DSC) is a powerful analytical technique widely used in the study of material properties, including the analysis of oxide layers. This blog will explore the various applications of DSC in oxide layer analysis, highlighting its significance and utility in different fields.

Scan and Built-In Self-Test (BIST) are chip testing methods. Scan testing adds circuitry for external fault detection, while BIST integrates self-testing mechanisms, allowing autonomous testing. Scan relies on external equipment; BIST enhances reliability with on-demand self-testing. Both improve fault detection but differ in implementation.

This article explores the key benefits of TXRF, including its high sensitivity, non-destructive nature, and reduced background noise, making it an ideal choice for trace element analysis in semiconductor manufacturing.

This article mainly introduces the application fields and advantages of TXRF.