Instrument Type:
Hystron PI89; Gatan straining holder
Analytical Program:
TEM in-situ compression test -- Contact us for quotation
TEM in-situ tensile test -- Contact us for quotation
TEM in-situ heating test -- Contact us for quotation
TEM in-situ electrical measuring test -- Contact us for quotation
In situ TEM, as a very practical high-end characterizationtechnology, its extremely high resolution is very suitablefor "in situ dynamic" observation of the microstructure ofvarious energy storage materials; In addition, combined with selected area electrondiffraction (SAED), Electron energy loss spectroscopy(EELS) and energy dispersive spectrometer (EDX), thestructural and chemical information of materials can beobtained;Therefore,themicrostructurechangesandelectrochemical reaction processes of the entire electrodematerial during the charging and discharging process canbe clearly presented.
Application range:
via TEM in-situ tensile or compression test to studythe plasticity (dislocation dynamics) and fracture ofmaterials
via TEM in-situ heating to study the microstructureevolution at high temperature or during heating up
via TEM electrical test to study the electrochemicalbehavior during a chemical reaction and with onlinemicrostructure evolution observation (e.g. in theresearch of Li-battery)
Caption: Dark-field TEM images of a Ni nanopillar beforeand after compression. The high dislocation densityinitially observed in the pillar has disappeared uponcompression. Nature Materials 7, 115-119 (2007).
Caption: Dark-field TEM images of a Ni nanopillar beforeand after compression. The high dislocation densityinitially observed in the pillar has disappeared uponcompression. Nature Materials 7, 115-119 (2007).Application 2: TEM in-situ nanoscratch testCaption: An example 1 μN scratch test: (1) Normal andlateral loads and displacements versus time and (2-5)corresponding frames from the in-situ TEM video showingthe buckling of the DLC film in advance of the tip andflattening of the asperities in the tops of the grains.
Caption: Electrical characterization during compression ofn-doped VLS-grown silicon nanopillar. D.D. Stauffer, Ph.D.Thesis, “Deformation Mechanisms in Nanoscale BrittleMaterials,” University of Minnesota (2011) pp. 150-152.
Core-shell electrochemical reaction TEM in-situ observationand measuring
Caption: Pillar compression of Ni-Based superalloy at1000°C (top) and stress-strain plots from in-situ pillarcompression tests of bond coatings (bottom).
Caption: TEM in-situ observation of oxides morphologyevolution during heating up